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General Cleaning


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#1 RedBullSugarfree

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Posted 09 October 2014 - 08:58 AM

Thanks for taking the time to read and respond to my post.

 

I am opening my sony vaio to clean out the dust. When I opened it I saw a piece of grey substance, my first guess is that it was a thermal compound. I think it was left in at the factory by accident. I've scoured the internet for pics of inside a sony vaio and have not found this block of clay in any other laptop. I'm almost sure it was by mistake but would like some experienced help with this before I throw it out. It has so much dust it would be nearly impossible to remove every piece of dust and lint from it.

 

What is it? 

 

The measurements of the hard clay/putty structure (thermal compound?) are 4.5 x 1 x 1 cm

 

View images here


Edited by RedBullSugarfree, 09 October 2014 - 04:32 PM.


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#2 Platypus

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Posted 09 October 2014 - 08:26 PM

It certainly has the appearance of a thermal pad, likely intended to conduct heat from a chip to the casing of the laptop. It probably initially adhered to the casing and dropped away as it was dismantled. Does the square imprint on it match the BGA chip at the top of the third image, behind the fan assembly? There also seems to be a couple of surface mount component imprints. I suspect it would be supposed to conduct heat away from that chip into the bottom of the casing when the clamshell is secured closed, to clamp it in between.


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#3 RedBullSugarfree

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Posted 09 October 2014 - 08:56 PM

The indents are diagonal which makes me think if it does not belong where I found it and it fell off at some point. I wonder if it should sit on top of the heatsink between the CPU and GPU? I have a support request into Sony but my warranty already expired so they may not give me a solid answer. It collects so much dust and just seems so out of place anywhere in the computer.



#4 RedBullSugarfree

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Posted 09 October 2014 - 09:19 PM

I updated the images



#5 mjd420nova

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Posted 09 October 2014 - 10:38 PM

It looks like a small piece of thermal foam, kind of like a shuttle tile.  It looks like it was sandwitched between the top of the heat pipe (the copper piping) it the processor and the case it self.  Meant to keep the case a safe distance from the top of the heatsink/heatpipe assembly so the plastic case won't melt.






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