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EXTRA Cooling Power, Waffer Style

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#1 Scarlett


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Posted 19 November 2004 - 10:41 AM

Component malfunction or meltdown, system instability and overclocking limitations are but a few obstacles facing high-performance computer designers,users and system optimizers.Review Date: October 20, 2004 Reviewer: Victor Moore The idea behind Waffer's PC Aircon PAC 400 is to deliver air cooled below ambient temperature to the entire system (essentially air conditioning it) and thereby creating a more stable environment in which the system's components can operate. This should in turn allow for systems to be more stable, allow for longer life expectancy and an overclocking ability of components. The cooling concept is achieved by means of the thermoelectric (TEC) principle. Discovered in 1834 by Jean Peltier, the principle works as follows: The application of a DC voltage to a closed circuit comprising of dissimilar metals, gives rise to a temperature change at the junction of the dissimilar metals.
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