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5.3 Heat Sink Solutions
One method of improving thermal performance is to increase the surface area of a device by attaching a metallic
heat sink. To maximize the heat transfer, the thermal resistance from the heat sink to the air can be reduced by
maximizing the airflow through the heat sink fins as well as by maximizing the surface area of the heat sink itself.
5.4 Pentium 4 processor Reference Heat Sink
Intel is enabling a reference heat sink for the Pentium® 4 processor. This active heat sink design includes a 60 mm
fan and is designed assuming a TLA of 45ºC and sufficient cross flow to maintain the local ambient temperature.
In order to maximize longevity, a heat sink consisting of folded aluminum fins brazed to a copper base has been
designed. The copper base provides increased heat spreading and the folded fins provide greater surface area for
5.4.1 Heat Sink Weight
The heat sink attachment requires a retention mechanism. Heat sinks that attach to the reference retention
mechanism should not exceed 450 grams. These are the design limits for the motherboard components, heat sink
retention mechanism, heat sink attach clips, and 423 pin socket to withstand mechanical shock and vibration.
The test limits for vibration are 10min/axis, 3 axes over a frequency range of 5Hz to 500Hz. This results in a Power
Spectral Density (PSD) of 3.13g RMS. The system level shock design limits are 30G trapezoidal, 11 ms duration,
170 in./sec minimum velocity change applied 3 times in the + and – directions in each of 3 perpendicular axes.
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